C1210C432K5HAC7800

Allen Bradley

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Applied Materials, IME open Singapore 3-D packaging lab

Anti-fuse NVM became practical when standard logic CMOS arrived at the 180-nm process node. This was the first process node for which the gate oxide breakdown voltage was less than that of the junction breakdown voltage. With each successively smaller process geometry, the gate oxide breakdown voltage continues to decrease along with transistor dimensions and the oxide thickness. Thus, anti-fuse technology has the benefit of improving with each new process generation: more bit cells per area, less power consumed to write and read the memory, and increased reliability as a result of less power consumed during operation.

Sensata Technologies

FinishAdapt

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Anti-fuse NVM became practical when standard logic CMOS arrived at the 180-nm process node. This was the first process node for which the gate oxide breakdown voltage was less than that of the junction breakdown voltage. With each successively smaller process geometry, the gate oxide breakdown voltage continues to decrease along with transistor dimensions and the oxide thickness. Thus, anti-fuse technology has the benefit of improving with each new process generation: more bit cells per area, less power consumed to write and read the memory, and increased reliability as a result of less power consumed during operation.

Implementation All developed approaches were implemented as MATLAB functions and then integrated into the Model Advisor by using the Simulink Verification and Validation (see Figure 8). Hereby we provide the user with an easy way to apply our solution using a graphical user interface.

Digi-Key

Aurel

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Implementation All developed approaches were implemented as MATLAB functions and then integrated into the Model Advisor by using the Simulink Verification and Validation (see Figure 8). Hereby we provide the user with an easy way to apply our solution using a graphical user interface.

As multicore processors benefit increasing numbers of high-performance, data-intensive applications, such as wireless basestations and high-performance compute platforms, system scalability can only be achieved through high-capacity embedded interconnect. Gigabit serial links help enable system scalability by reducing system cost, area footprint and pin count while delivering greater parallelism, performance and capacity.

Holy Stone
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