SANTA CLARA, Calif. — Dimensions Consulting Inc. (DCI) here rolled out a low-power engineering test socket line for use in prototyping complex ICs.

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RWR81S5R11FRS70_Vishay Dale_Through Hole Resistors

Bud Industries, Inc.

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It is external pressures, such as the downturn in the European market for mobile phones, coupled with unfavourable exchange rates that has led to this regrettable decision. We will make every effort to minimise the impact of this decision.”

The VC-800 VCXO is hermetically sealed in a 3.2- x 5- x 1.5-mm ceramic LCC with six contact pads. Selected frequencies between 1.544 and77.67 MHz are available with a 3.3- or 5-V supply voltage. Phase jitter performance is greater than 6 ps rms for frequencies greater than 12MHz. Target applications include xDSL CPE, PCMCIA cards, and ATM/SONET/SDH applications.

MCM Electronics

Nuvoton Technology Corporation America

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The VC-800 VCXO is hermetically sealed in a 3.2- x 5- x 1.5-mm ceramic LCC with six contact pads. Selected frequencies between 1.544 and77.67 MHz are available with a 3.3- or 5-V supply voltage. Phase jitter performance is greater than 6 ps rms for frequencies greater than 12MHz. Target applications include xDSL CPE, PCMCIA cards, and ATM/SONET/SDH applications.

He has previously been involved with a number of government committees on the funding of UK technology companies and R&D.

Ethertronics

Skyworks Solutions, Inc.

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He has previously been involved with a number of government committees on the funding of UK technology companies and R&D.

Semico ger en femårsprognos för både DSL- och kabelmodem samt anger marknadsandelar för ledande företag. Utifrån materiallistor och prognoser görs kalkyler över den tillgängliga marknaden för halvledarkonsumtion vad det gäller mikrologik, DRAM, Flash, logikkort, minnen och diskreta halvledare. Studien visar till exempel att den totala DRAM-konsumtionen för kabel- och DSL-modem kommer att växa från dagens 60 miljoner dollar till mer än 600 miljoner dollar år 2005. Undersöningarna ställer även prognoser som visar på behovet av 200mm wafers för att kunna tillverka det förutspådda antalet chip.

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