D2F-FL-A_Datasheet PDF

BEI Duncan

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The surrounding controversy, however, did not shade the DS-UWB camp's day in the sun. The voter's are telling the MBOA leadership what's really going on,” said Martin Rofheart, director of UWB operations at Freescale Semiconductor (Vienna, VA). Rofheart put the shift in opinion down to the MBOA camp not distinguishing its technology clearly enough from those being put before the 802.11n wireless LAN (WLAN) task group, particularly with respect to OFDM, a critical component of the MBOA proposal. So now you have organizations rethinking their map and which technologies they need to round out their product offerings,” he said. This is just the tip of the iceberg.”

Power consumption is a major source of pain for emerging complex SOC designs, particularly in battery sensitive applications requiring ultra low power. Not surprisingly, this area was the topic with the largest number of paper submissions at the DATE conference in Paris this year. The power pain will accelerate when moving to nanometer technologies with increased transistor counts and densities.

GeneSiC Semiconductor

KUKA Robotics

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Power consumption is a major source of pain for emerging complex SOC designs, particularly in battery sensitive applications requiring ultra low power. Not surprisingly, this area was the topic with the largest number of paper submissions at the DATE conference in Paris this year. The power pain will accelerate when moving to nanometer technologies with increased transistor counts and densities.

The IC's low dropout, high PSRR (power supply ripple rejection), and low ground current, coupled with low noise and fast turn-on time (30 microseconds), make it an ideal solution for today's most demanding portable applications,” said Steve Knoth, LDO product manager. Each LDO, working from a 2.25- to 5.5-volt input and providing up to 250 mA, offers a dropout of just 100 mV typical at 150 mA. The chip's PSRR is more than 70 dB at 1 kHz and ground current is less than 110 microamps per output at light load. The chip is a &#956Cap design, which ensures a stable output with small ceramic output capacitors.

Lightech

Hillcrest Labs

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The IC's low dropout, high PSRR (power supply ripple rejection), and low ground current, coupled with low noise and fast turn-on time (30 microseconds), make it an ideal solution for today's most demanding portable applications,” said Steve Knoth, LDO product manager. Each LDO, working from a 2.25- to 5.5-volt input and providing up to 250 mA, offers a dropout of just 100 mV typical at 150 mA. The chip's PSRR is more than 70 dB at 1 kHz and ground current is less than 110 microamps per output at light load. The chip is a &#956Cap design, which ensures a stable output with small ceramic output capacitors.

An even bigger issue is the handling of biometric data. ICAO says nothing about the backbone system,” said Infineon's Houdeau. Developing rules and regulations on what to do with the [biometrics] data” once it's collected and stored on a chip is up to each government.The EC is now debating access control — whether to allow unlimited access, or to specify restrictions — to the biometric data stored on a passport chip. One proposal is that the biometric data cannot be unlocked, or made available for reading, unless an optical-character number used in the passport is first read by an optical-machine reader. This extra layer of data protection would prevent biometric data from being skimmed” without the knowledge of the passport holder, according to Bundesdruckerei's Hemme.

Echelon by Adesto
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