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high current digital potentiometer

AB Elektronic

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ASML said it would recognize the sales of its first two NXE:3100 preproduction EUV tools in the third quarter. Meurice said that by the middle of this month ASML will have shipped a total of five NXE:3100 tools. Earlier this week, IMEC announced that it exposed its first EUV wafers using the NXE:3100. Several customers having already exposed hundreds of wafers with resolutions as small as 18-nm using the NXE:3100, Meurice said. ASML said it plans to introduce NXE:3300 by next summer.

Intel has been clear it expects to take two years or more to achieve its ultrabook goal. Late this year, first generation ultrabooks are expected to ship using Intel’s Sandy Bridge processors powering systems that are less than 21mm (0.8 inch) thick at mainstream prices,” Intel said.

APEM Inc.

Rosenberger

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Intel has been clear it expects to take two years or more to achieve its ultrabook goal. Late this year, first generation ultrabooks are expected to ship using Intel’s Sandy Bridge processors powering systems that are less than 21mm (0.8 inch) thick at mainstream prices,” Intel said.

For years, developers of MRAM and other next-generation memory technologies have claimed that they would become the ultimate universal memory and replace today’s memories. But, to date, none of the technologies have lived up to the hype, while current memory technologies such as DRAM and NAND have continued to scale.   

GardTec

Alliance Memory, Inc.

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For years, developers of MRAM and other next-generation memory technologies have claimed that they would become the ultimate universal memory and replace today’s memories. But, to date, none of the technologies have lived up to the hype, while current memory technologies such as DRAM and NAND have continued to scale.   

Intel announced the ultrabook concept at Computex in Taipei in June . The goal is a thin and light notebook that also has tablet features such as a touch screen.

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