Amphenol Advanced Sensors

Nissei

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AnDAPT, Inc.

Marketing Executive

LONDON – Nanosolar Inc., a company founded in 2002 to pursue the roll-to-roll printing of CIGS (copper, indium, gallium, selenium) photovoltaics on aluminum foil, has raised $70 million.

Murata Americas has added the DMG series to its line of thin, low-resistance, electrical double-layer capacitors (EDLCs). 

Email: marketing@company.com
Mobile: 080-022-0540
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CogniMem

Online Advertising Manager

Murata Americas has added the DMG series to its line of thin, low-resistance, electrical double-layer capacitors (EDLCs). 

According to Sigrity, the chip IO models created by XcitePI IO Interconnect Model Extraction offer both high resolution and compact size to ensure accuracy and efficiency. These models can be used in conjunction with SPICE-compatible circuits for system-level simulations. Taking chip layout data in GDSII or LEF/DEF formats, the XcitePI IO Interconnect Model Extraction tool generates a SPICE netlist that consists of a fully distributed IO power/ground model and IO signal connections from IO cells to bumps. It accounts for all coupling between the power, ground and signals on the chip, the distributed capacitance associated with the power and ground systems, and on-chip decoupling capacitors connected to the power and ground systems. The resulting chip IO interconnect model includes external terminals on the bump side with Sigrity’s Model Connection Protocol (MCP) header information for easy connection to IC package models. Similarly, the model includes external terminals at the IO cell level to streamline connection with targeted driver/receiver models. Thus XcitePI IO Interconnect Model Extraction provides precise interconnect models for chips, packages and boards – an essential requirement for accurate signal integrity analysis of high-speed channels and buses.

Email: advertising@company.com
Mobile: 056-140-0550
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TEKTELIC Communications

Web Application Project Manager

According to Sigrity, the chip IO models created by XcitePI IO Interconnect Model Extraction offer both high resolution and compact size to ensure accuracy and efficiency. These models can be used in conjunction with SPICE-compatible circuits for system-level simulations. Taking chip layout data in GDSII or LEF/DEF formats, the XcitePI IO Interconnect Model Extraction tool generates a SPICE netlist that consists of a fully distributed IO power/ground model and IO signal connections from IO cells to bumps. It accounts for all coupling between the power, ground and signals on the chip, the distributed capacitance associated with the power and ground systems, and on-chip decoupling capacitors connected to the power and ground systems. The resulting chip IO interconnect model includes external terminals on the bump side with Sigrity’s Model Connection Protocol (MCP) header information for easy connection to IC package models. Similarly, the model includes external terminals at the IO cell level to streamline connection with targeted driver/receiver models. Thus XcitePI IO Interconnect Model Extraction provides precise interconnect models for chips, packages and boards – an essential requirement for accurate signal integrity analysis of high-speed channels and buses.

The standard adopts the well-known SCSI Architecture Model and command protocols supporting multiple commands with command queuing features and enabling a multi-thread programming paradigm. This differs from conventional flash-based memory cards and embedded flash solutions which process one command at a time, limiting random read/write access performance. In addition, a forthcoming complementary UFS Host Controller Interface (HCI) specification will allow system designers greater flexibility by simplifying the involvement of the host processor in the operation of the flash storage subsystem. The UFS HCI specification and the adoption of SCSI will provide a well-known software programming model and enable wider market adoption.

Email: manager@company.com
Mobile: 042-366-1400

Quick Logic

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SiTime

AHA50AFB-12R1

The standard adopts the well-known SCSI Architecture Model and command protocols supporting multiple commands with command queuing features and enabling a multi-thread programming paradigm. This differs from conventional flash-based memory cards and embedded flash solutions which process one command at a time, limiting random read/write access performance. In addition, a forthcoming complementary UFS Host Controller Interface (HCI) specification will allow system designers greater flexibility by simplifying the involvement of the host processor in the operation of the flash storage subsystem. The UFS HCI specification and the adoption of SCSI will provide a well-known software programming model and enable wider market adoption.

RDA Microelectronics, founded here in 2004 and listed on the Nasdaq exchange since November 2010, is a leading Chinese fabless IC vendor supplying RF and mixed-signal chips for cellular and broadcast communications used by China handset manufacturers.

David Henrich Electronics CorporationVolex
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